厂商 :深圳市鼎华科技有限公司
广东 深圳- 主营产品:
- 除锡线
- 锡球
- 钢网
DH-C1 技术参数
总功率 |
Total Power |
4800W |
上部加热功率 |
Top heater |
800W |
下部加热功率 |
Bottom heater |
第二温区1200W,第三温区2700W(加大型发热面积以适应各类P板) |
电源 |
power |
AC220V±10% 50/60Hz |
外形尺寸 |
Dimensions |
L500×W600×H650 mm |
定位方式 |
Positioning |
V字型卡槽,PCB支架可X方向调整并外配万能夹具 |
温度控制方式 |
Temperature control |
K型热电偶(K Sensor) 闭环控制(Closed loop) |
温度控制精度 |
Temp accuracy |
±2℃ |
PCB尺寸 |
PCB size |
Max 500×400 mm Min 22×22 mm |
适用芯片 |
BGA chip |
2X2-80X80mm |
适用最小芯片间距 |
Minimum chip spacing |
0.15mm |
外置测温端口 |
External Temperature Sensor |
1个,可扩展(optional) |
机器重量 |
Net weight |
31kg |
Feature:
1.Embedded with industrial PC and Windows OS, high definition touch screen interface, PLC control and start-up password for protection and modification. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary.
2.K sensor close loop control and automatic temperature compensation system. It combines with temperature module, which enables temperature accuracy to ±2°C.
3.V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.
4.Flexible and convenient removable fixture on the PCB board which protects and prevent damage to PCB. It can also adapt to rework various BGA packages.
5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement
6.The machine uses independent temperature controller for upper hot-air heater, low hot-air heater and bottom IR heater. Heating time, temperature and profile are controlled by the touch screen display.
7.There are 6-8 levels of variable and constant temperature controls. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen. Three heating areas adopts independent PID calculation to control heating process to enable more accurate and precise temperature control
8.Temperature rise more balanced, temperature more accutate
9.Powerful cross flow fan, cooling the PCB board efficient after heating, to prevent it from deformation. External vacuum pen, easy for handling BGA chip.
10.Sound hint system. There is an alarm before the completion of each desoldering and soldering
11.CE certification, with emergency switch and automatic power-off protection device when emergency happens
12.Three years warranty for the heating system, one year for the whole machine(Two years longer than other companies), free life-long technical support
DH-C1主要性能与特点:
● 嵌入式工控电脑,高清触摸屏人机界面,PLC控制,并具有瞬间曲线分析功能. 实时显示设定和实测温度曲线,并可对曲线进行分析纠正。
● 高精度K型热电偶闭环控制和温度自动补偿系统,并结合PLC和温度模块实现对温度的精准控制,保持温度偏差在±2℃.同时外置测温接口实现对温度的精密检测,并实现对实测温度曲线的精确分析和校对.
● PCB板定位采用V字型槽,定位快捷、方便、准确,满足不同PCB板排版方式及不同大小PCB板的定位.
● 灵活方便的可移动式万能夹具对PCB板起到保护作用,防止PCB边缘器件损伤及PCB变形,并能适应各种BGA封装尺寸的返修.
● 配备多种规格合金风嘴,该风嘴可360度任意旋转定位,易于安装和更换;
● 上下共三个温区独立加热,三个温区可同时进行多组多段温度控制,保证不同温区同步达到最佳焊接效果。加热温度、时间、斜率、冷却、真空均可在人机界面上完成设置。
● 上下温区均可设置6~8段温度控制,可海量存储温度曲线,随时可根据不同BGA进行调用,在触摸屏上也可进行曲线分析、设定和修正 ; 三个加热区采用独立的PID算法控制加热过程,升温更均匀,温度更准确;
● 采用大功率横流风机迅速对PCB板进行冷却,以防PCB板的变形;同时内置真空泵,外置真空吸笔,以方便快捷取拿BGA芯片;
● 配置声控“提前报警”功能.在拆卸、焊接完成前5-10秒以声控方式警示作业人员作相关准备。上下热风停止加热后,冷却系统启动,待温度降至常温后自动停止冷却。保证机器不会在热升温后老化!
● 经过CE认证,设有急停开关和突发事故自动断电保护装置。