厂商 ：东莞市佳盛伟科技有限公司
广东 东莞市- 主营产品：
- 反光膜
- 蓄光膜
- 615热熔胶膜
联系电话 ：18320875763
商品详细描述
JSW Thermal Bonding Film 615S is a flexible, light colored, thermoplastic adhesive bonding film which exhibits good
Note: Appropriate application equipment can enhance bonding film performance.
for the user’s evaluation in light of the user’s particular purpose and method of application.
The type of equipment used to JSW Thermal Bonding Film (TBF) 615 will depend on the application and on the
type of equipment available for the user. Thin films and flexible substrates can be bonded using a heated roll laminator
where heat and pressure can be varied to suit the application. Larger, thicker substrates can be JSW Thermal Bonding Film 615 bonded using a heated
static press or, in some , an autocle. For applications where a shaped adhesive is to be transferred to a flat or
three-dimensional part, a hot shoe or thermode method may be appropriate.
It is recommended that whatever method of bonding the user chooses, the user should determine the optimum
bonding conditions using the specific substrates involveOne approach to establishing the correct/optimum bonding conditions for a user’s application is to evaluate a series
and more difficult to bond surfaces will require longer times, higher pressures and higher temperatures.
Once the bond is made, the bondline should be allowed to cool somewhat before stress is applied to the bond. Generally,
cooling the bondline below 93°C (200°F) is adequate to allow the bonded parts to be unfixtured/unclamped and handled.
For reference, the following tables show typical bond strengths for bonds made at various temperatures. Such tables
can be used to evaluate optimum bondline temperatures. It is very important to note that this table is valid only for
the specific substrates shown. Varying temperature, pressure, or substrates can affect bond strengths. User should
develop a similar table using the specific substrates involved. d.
Unless an additional warranty is specifically stated on the applicable JSW Thermal Bonding Film 615 product packaging or product literature,
Note: Appropriate application equipment can enhance bonding film performance.
for the user’s evaluation in light of the user’s particular purpose and method of application.
The type of equipment used to JSW Thermal Bonding Film (TBF) 615 will depend on the application and on the
type of equipment available for the user. Thin films and flexible substrates can be bonded using a heated roll laminator
where heat and pressure can be varied to suit the application. Larger, thicker substrates can be JSW Thermal Bonding Film 615 bonded using a heated
static press or, in some , an autocle. For applications where a shaped adhesive is to be transferred to a flat or
three-dimensional part, a hot shoe or thermode method may be appropriate.
It is recommended that whatever method of bonding the user chooses, the user should determine the optimum
bonding conditions using the specific substrates involveOne approach to establishing the correct/optimum bonding conditions for a user’s application is to evaluate a series
and more difficult to bond surfaces will require longer times, higher pressures and higher temperatures.
Once the bond is made, the bondline should be allowed to cool somewhat before stress is applied to the bond. Generally,
cooling the bondline below 93°C (200°F) is adequate to allow the bonded parts to be unfixtured/unclamped and handled.
For reference, the following tables show typical bond strengths for bonds made at various temperatures. Such tables
can be used to evaluate optimum bondline temperatures. It is very important to note that this table is valid only for
the specific substrates shown. Varying temperature, pressure, or substrates can affect bond strengths. User should
develop a similar table using the specific substrates involved. d.
Unless an additional warranty is specifically stated on the applicable JSW Thermal Bonding Film 615 product packaging or product literature,
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