STANNOL无卤焊锡膏

STANNOL SP1100无卤素焊锡膏优良的粘度稳定性，高常量的打印行为，少量的透明残留物。

STANNOL SP2500无卤素焊锡膏氧氮完全润湿，最小空隙率抗毛细管作用，特别是在QFP和QFN元件。

The solder paste SP2500 has been developed for the high volume, lead-free SMD electronics manufacturing. The solder paste is characterized by less voiding. The long open times and the high printability have a positive effect on the soldering result. With a special formula for excellent wetting, it meets the requirements for wetting on the surfaces which can be found today in every series manufacturing process.

The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.

PRODUCT ADVANTAGES
Less voiding
Reflow under air and nitrogen atmosphere possible
Long open times of the paste
No-Clean
Less residues, good electrical safety
Stable printing characteristics