MATEDEX 零卤素QFN全爬锡SAC305

1.非凡的润湿特性，广泛的工艺窗口，完美的焊接效果.

2.残留物透明，极低空洞率。

3.SP2500具有显著的气孔减少趋势，尤其是BGA和QFN元器件。

The lead free Matedex SP2500 no-clean Solderpaste is designed to achieve extraordinary wetting characteristics in combination with a wide spreaded process window for perfect soldering results. Being optimized for lead free alloy compositions and fine pitch powder sizes (T4 and below) the Matedex SP2500 is the choice for high production throughput. High Quality soldering results can be expected on a variety of different surface finishes with transparent residues. In comparison to various other solderpastes the SP 2500 tends to significant void reduction in particular with BGA and QFN components.