深圳龙华锡膏批发SP2500价格

The lead free Stannol SP 2500 no-clean solderpaste is designed to achieve extraordinary wetting characteristics in combination with a wide spreaded process window for perfect soldering results. Being optimized for lead free alloy compositions and fine pitch powder sizes (T4) the Stannol SP 2500 is the primary choice for high production throughput. High Quality soldering results can be expected on a variety of different surface finishes with transparent residues. In comparison to various other solder pastes the SP 2500 tends to a significant void reduction in particular with BGA and QFN components. To achieve the full performance of void reduction in number and size 无铅Stannol SP 2500清洁锡膏旨在实现非凡的润湿 　　特点结合广泛传播过程窗口完美的焊接结果。 　　被优化无铅合金成分和微细粉末大小(T4) 　　Stannol SP 2500生产吞吐量高是主要的选择。 　　高质量的焊接结果预计会在各种不同的表面装饰与透明的残留物。在 　　相比其他各种焊锡膏SP 2500倾向于减少特定的一个重要空白BGA和QFN 　　组件。 　　实现完整的空隙减少数量和规模的性能。