厂商 ：北京芯时代电子科技发展有限公司
北京 通州区- 主营产品：
- IC
- 步进电机
联系电话 ：18376413123
商品详细描述
THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is
utilize advanced TOSHIBA NAND flash device(s) and controller chip
assembled as Multi Chip Module. THGBMBG5D1KBAIL
has an industry standard MMC protocol for easy use.
THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with
1-I/O, 4-I/O and 8-I/O mode.
需要的亲，Q我 1242388708
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