QFN除锡机

全自動除錫風刀規格
1.  品   名    : 全自動除錫風刀
1. Product name: Automatic de-soldering air-knife
2.  型   號    : TU-680X

Model no    : TU-680X
3.  重   量    :  55 kg  
3. Weight   : 55kg
4.外部尺寸  :  57cm(L)× 67cm(W)×60cm(H)                                              
4. Outside dimension: 570cm(L)× 670cm(W)×650cm(H)   
5.使 用 電 壓 :  AV110V/50/60HZ
5. Working voltage: AV110V / 220V50/60HZ
6.最大使用電流 :  18 A
6. Maximum working current : 18A
7.使 用 氣 壓  :  7.5 kg/c㎡
7. Working air pressure: 7.5kg/c㎡
8.使用規格範圍 :  27mm×27mm ~ 40mm×40mm
8. Working package range: 27mm×27mm ~ 40mm×40mm
9.清除有效寬度 :  40mm
9.Effective cleaning length : 40mm
10.清除週期時間 :  依設定參數值總和為目前清除時間週期
10 Cleaning cycle time: According to total of all setting parameters.
11.清 除 元 件  :  BGA -IC  .POP-IC元件
11.Cleaning part: BGA IC parts.
12. 360°照明燈 :  6瓦
12. 360°illumination lamp: 6 Watt.
13.風刀流量表(每分28l): 調節範圍0 ~ 5 M3/min(1 LPM =28 l/min)
13.Air-knife flow meter(28 liter/min): Tuning range :0 ~ 5

     M3/min(1 LPM =28 l/min)      
  

全自動除錫風刀特點
Automatic de-soldering air-knife features
1.使用全自動除錫風刀處理B.G.A.表面錫球.錫渣.清除作業,方便,迅速.效率.

   均符何最佳維修要求.
   It is accurate, easier, faster and effective to clean the additional

   solder ball and solder waste on B.G.A. package to comply with the

   best rework requirement.
2.人性化螢幕面板設計,觸控參數設定功能鍵,操作簡易.
2.The screen panel design is humanized and the touch-control

   function keys are easy to use.

本機優點: Advantages of this machine:

1.採人機操作觸控功能鍵執行精密參數設定,精度高,功能強,易操作.
1. By using interactive touch-control screen to perform accurate 

    parameter setting with high precision, powerful function and

    easy handling.
2.本機使用風刀作錫渣清除作業.
2.The machine cleans the solder waste by using air-knife.
3.清除錫渣本機無傳統吸錫線清錫球作業成本.
3.There is no need and cost of solder-attracting wire of

   conventional solder ball cleaning operation.
4.清除錫渣採風刀清除方式.
4.The solder waste is cleaned out with using air-knife.
5.本機清除作業採非接觸性清除方式,B.G.A.IC PAD點無翹皮之虞.
5.The cleaning process is a non-contact operation. There is no

   orry about B.G.A. IC pad warp problem.

6.採整體性重疊面清除方式確實有效做PAD點錫渣清除作業.
6.It is effective and efficient for solder waste cleaning operation

   on pad by using overall and overlapping cleaning method.
7.採熱風迴焊熔錫B.G.A.表面PAD點錫球面受熱均勻.
7.The surface of solder ball on pad of B.G.A. is heated uniformly

    by applying hot air re-flowing in de-soldering process.
8.採 PID微電腦溫控,具自動微調加溫時間及調節溫度曲線寬度功能.
8.By adopting PID temperature controller of microcomputer,

   there are functions of heating time auto tuning and temperature 

   profile range adjusting.
9.本機參數設定精度達 1/10秒.
9.The precision of parameter setting can be achieved to 1/10

   second.
10.當執行作業途中遇氣壓源不足時,本機具瞬間斷電加熱器電源保護系統,

     防止外在因素造成作業不良,亦可保護加熱器因氣源不足導致散熱不良.

     造成鎢絲損害或燒毀,並同時停止所有操作功能操作.

11.當設定不良或操作不良,及外在因素造成溫度過高,任何一組溫控超過設定

     溫度,瞬間斷電所有加熱器電源,防止元件作業當中造成損害,並保護鎢絲

     因過熱造成損害或燒毀.
11.For protecting tungsten filament and elements from over-heat

     damage or burning out, the power of all heater will be cut off

     when bad setting, bad operation or outside factors cause

     temperature over the setting value in temperature controller.
12.除錫風刀循環作業流程均以參數值設定,預設值細精度高,可調整設定範

      圍大,可設定變數選擇多,詳加做最佳設定值追縱紀錄,能追求出最佳設定

      需求值.
12.All operation procedure of de-soldering air-knife are defined

       by parameters. The precision is high and the adjustable range

       is wide and parameter setting selections are many. If the best

       setting records are traced, there will be a optimum setting value.
13.採用除錫風刀,做除錫動作,可確保元件完整性,每次加熱附予B.G.A.表面受

       熱數據如出一撤,可信度高.
13.By using air-knife for de-soldering, the package can be kept as

      undamaged. The heating data of each cycle on B.G.A. surface.