BGA除锡机POP除锡机

全自動除錫風刀特點
Automatic de-soldering air-knife features
1.使用全自動除錫風刀處理B.G.A.表面錫球.錫渣.清除作業,方便,迅速.效率.

   均符何最佳維修要求.
   It is accurate, easier, faster and effective to clean the additional

   solder ball and solder waste on B.G.A. package to comply with the

   best rework requirement.
2.人性化螢幕面板設計,觸控參數設定功能鍵,操作簡易.
2.The screen panel design is humanized and the touch-control

   function keys are easy to use.

本機優點: Advantages of this machine:

1.採人機操作觸控功能鍵執行精密參數設定,精度高,功能強,易操作.
1. By using interactive touch-control screen to perform accurate 

    parameter setting with high precision, powerful function and

    easy handling.
2.本機使用風刀作錫渣清除作業.
2.The machine cleans the solder waste by using air-knife.
3.清除錫渣本機無傳統吸錫線清錫球作業成本.
3.There is no need and cost of solder-attracting wire of

   conventional solder ball cleaning operation.
4.清除錫渣採風刀清除方式.
4.The solder waste is cleaned out with using air-knife.
5.本機清除作業採非接觸性清除方式,B.G.A.IC PAD點無翹皮之虞.
5.The cleaning process is a non-contact operation. There is no

   orry about B.G.A. IC pad warp problem.
 

6.採整體性重疊面清除方式確實有效做PAD點錫渣清除作業.
6.It is effective and efficient for solder waste cleaning operation

   on pad by using overall and overlapping cleaning method.
7.採熱風迴焊熔錫B.G.A.表面PAD點錫球面受熱均勻.
7.The surface of solder ball on pad of B.G.A. is heated uniformly

    by applying hot air re-flowing in de-soldering process.
8.採 PID微電腦溫控,具自動微調加溫時間及調節溫度曲線寬度功能.
8.By adopting PID temperature controller of microcomputer,

   there are functions of heating time auto tuning and temperature 

   profile range adjusting.
9.本機參數設定精度達 1/10秒.
9.The precision of parameter setting can be achieved to 1/10

   second.
10.當執行作業途中遇氣壓源不足時,本機具瞬間斷電加熱器電源保護系統,

     防止外在因素造成作業不良,亦可保護加熱器因氣源不足導致散熱不良.

     造成鎢絲損害或燒毀,並同時停止所有操作功能操作.

10.When insufficient air supply is happened during operation,the

      power of heater will be cut off immediately as a protection

      system. The purpose is to prevent mis-operating from

      external factor or bad heat dissipation of heater which will

      cause tungsten filament damage or burn out. And in the same

      time, all operation function will be stopped.