厂商 ：深圳市昊光机电科技应用有限公司
广东 深圳- 主营产品：
- 离子刻蚀机
- 真空镀膜机
- 真空配件
联系电话 ：13928453655
商品详细描述
设备名称：OXFORD LASER C系列生产激光微加工系统
C Series Production Laser Micromachining System
Robust full production system
Key Benefits
•Shop floor hardened for 24/7 production
•Multi-axis capability (up to 5 axes)
•Vibration resistant massive granite frame
•Low maintenance diode pumped laser
•Long life air bearing x-y stages
•Powerful, user friendly, Cimita software
A robust laser micromachining system designed for high-throughput production. Designed as a machine-tool, ready to fit into your production facility. C Series systems can be configured for micro-drilling, micro-cutting, micro-milling or for a combination of processes.
C-Series state-of-the-art turnkey laser micromachining systems are designed specifically to provide stable, reproducible production in a tough environment. The C Series is built around a massive granite frame mounted on a vibration isolation platform making the system impervious to ambient vibration. The class 1 enclosure protects the system from contamination and changes in temperature. Oxford Lasers Cimita micromachining software simplifies manufacturing by allowing you to go straight from CAD model to production.
A range of diode pumped, solid state lasers are offered, providing a range of wavelengths and powers for all production needs. With the correct choice of laser, almost all solids can be machined including: metals (e.g. stainless steel, tungsten, titanium, copper, aluminium), ceramics (e.g. alumina, zirconia, silicon nitride), super-hard materials (e.g. diamond, tungsten carbide), semiconductors (e.g. silicon), graphite and plastics (e.g. polyimide, PMMA, polycarbonate). Composites and laminates can also be machined.
In addition to being configurable for micro-drilling, micro-cutting and micro-milling, the system can be configured specifically to match your process, with options to add longer travel stages (up to450mm X-Y and 150mm Z), galvo scanners, trepanning heads, taper control systems, automatic alignment, two rotation axes, additional chucks and fume extraction.
Please contact us to request a data sheet or to discuss your application.
Applications
•High volume drilling
•Wafer scribing
•Thin film patterning
•Via drilling
•Micro-milling
Specifications
Wavelength:
Choose the most suitable for your application.
Laser Type: Diode PumpedSolid State
强大的完整的生产系统
主要优点
•可满足全天候的生产作业
•多轴能力（高达5轴）
•巨大的耐振动坚固框架
•低维护二极管泵浦激光器
•长寿命气浮轴承的X-Y阶段
•功能强大，用户界面友好，软件Cimita
一个强大的激光微加工系统设计用于高产量的生产。设计成一台机器工具，以便适应您的生产设施。 C系列系统可配置微钻，微切割，微铣削或相结合的过程。
C系列强大的最先进的交钥匙激光微加工系统是专为在一个艰难的环境中提供稳定，重复性生产。 C系列是围绕着一个巨大的坚固的隔振平台，使系统不受环境振动的框架。 1类外壳保护系统免受污染和温度的变化。牛津激光Cimita微细软件，从而简化到可以让你直接从CAD模型到生产制造。
一个全范围的二极管泵浦固态激光器提供，提供的所有生产需要的波长和能力范围。随着激光技术的正确选择，几乎所有的固体，可以包括：金属（如不锈钢，钨，钛，铜，铝），陶瓷（如氧化铝，氧化锆，氮化硅），超硬材料（如金刚石，钨加工硬质合金），半导体（如硅），石墨和塑料（如聚酰亚胺，聚碳酸酯，聚甲基丙烯酸甲酯）。复合材料和层压板，也可以加工。
此外，微钻，微切削和微铣削配置，可以配置专门的系统，以匹配您的过程中，添加较长的行程阶段（至450mm XY轴和150mmZ轴），振镜扫描仪选项，穿孔头，锥度控制系统，自动对准，两个旋转轴，额外的夹头和排烟。
应用
•大批量钻孔
•晶圆划线
•薄膜图案
•通过钻探
•微铣削
规格
波长：
选择最适合你的应用程序。
激光类型：半导体泵浦全固态
C Series Production Laser Micromachining System
Robust full production system
Key Benefits
•Shop floor hardened for 24/7 production
•Multi-axis capability (up to 5 axes)
•Vibration resistant massive granite frame
•Low maintenance diode pumped laser
•Long life air bearing x-y stages
•Powerful, user friendly, Cimita software
A robust laser micromachining system designed for high-throughput production. Designed as a machine-tool, ready to fit into your production facility. C Series systems can be configured for micro-drilling, micro-cutting, micro-milling or for a combination of processes.
C-Series state-of-the-art turnkey laser micromachining systems are designed specifically to provide stable, reproducible production in a tough environment. The C Series is built around a massive granite frame mounted on a vibration isolation platform making the system impervious to ambient vibration. The class 1 enclosure protects the system from contamination and changes in temperature. Oxford Lasers Cimita micromachining software simplifies manufacturing by allowing you to go straight from CAD model to production.
A range of diode pumped, solid state lasers are offered, providing a range of wavelengths and powers for all production needs. With the correct choice of laser, almost all solids can be machined including: metals (e.g. stainless steel, tungsten, titanium, copper, aluminium), ceramics (e.g. alumina, zirconia, silicon nitride), super-hard materials (e.g. diamond, tungsten carbide), semiconductors (e.g. silicon), graphite and plastics (e.g. polyimide, PMMA, polycarbonate). Composites and laminates can also be machined.
In addition to being configurable for micro-drilling, micro-cutting and micro-milling, the system can be configured specifically to match your process, with options to add longer travel stages (up to
Please contact us to request a data sheet or to discuss your application.
Applications
•High volume drilling
•Wafer scribing
•Thin film patterning
•Via drilling
•Micro-milling
Specifications
Wavelength:
Choose the most suitable for your application.
Laser Type: Diode Pumped
强大的完整的生产系统
主要优点
•可满足全天候的生产作业
•多轴能力（高达5轴）
•巨大的耐振动坚固框架
•低维护二极管泵浦激光器
•长寿命气浮轴承的X-Y阶段
•功能强大，用户界面友好，软件Cimita
一个强大的激光微加工系统设计用于高产量的生产。设计成一台机器工具，以便适应您的生产设施。 C系列系统可配置微钻，微切割，微铣削或相结合的过程。
C系列强大的最先进的交钥匙激光微加工系统是专为在一个艰难的环境中提供稳定，重复性生产。 C系列是围绕着一个巨大的坚固的隔振平台，使系统不受环境振动的框架。 1类外壳保护系统免受污染和温度的变化。牛津激光Cimita微细软件，从而简化到可以让你直接从CAD模型到生产制造。
一个全范围的二极管泵浦固态激光器提供，提供的所有生产需要的波长和能力范围。随着激光技术的正确选择，几乎所有的固体，可以包括：金属（如不锈钢，钨，钛，铜，铝），陶瓷（如氧化铝，氧化锆，氮化硅），超硬材料（如金刚石，钨加工硬质合金），半导体（如硅），石墨和塑料（如聚酰亚胺，聚碳酸酯，聚甲基丙烯酸甲酯）。复合材料和层压板，也可以加工。
此外，微钻，微切削和微铣削配置，可以配置专门的系统，以匹配您的过程中，添加较长的行程阶段（至
应用
•大批量钻孔
•晶圆划线
•薄膜图案
•通过钻探
•微铣削
规格
波长：
选择最适合你的应用程序。
激光类型：半导体泵浦全固态
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