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广东 深圳- 主营产品:
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商品详细描述
设备名称:OXFORD LASER G系列双光束生产激光微加工系统
G Series Dual Beam Production Laser Micromachining System
Leading edge laser micro machining in a fully integrated package with dual beam capability
Key Benefits
•Dual wavelength means that a wide range of materials can be processed
•Vibration isolated granite construction for ultimate stability
•Turn-key operation for maximum usability
•Advanced CNC controller software
A dual wavelength laser micromachining system offering high throughput in a demanding industrial setting, or high-quality, high-flexibility process development in an R&D environment.
Some lasers are unsuitable for machining some materials - they are not suitably absorbed, making machining slow or ineffective. A dual wavelength system allows maximum flexibility by increasing the range of materials that you can machine. This capability allows composite materials to be processed, reducing process steps and reducing costs.
The turn-key system features a class 1 enclosure, which ensures that your operator remains safe. The vibration isolated granite machining bed ensures ultimate stability and guarantees maximum repeatability and minimum wastage in the parts produced.
Oxford Lasers advanced CNC controller and software means that you can go from CAD model to a produced part in one simple step, with single screen software control. The linear stage offer300mm X-Y travel (optionally increased to 400mm ) and 150mm Z. An on-axis vision system simplifies alignment and allows inspection of parts as they are finished.
If required, we can add trepanning systems, galvo scanners, taper reduction systems, auto-focus and auto-alignment, height and depth sensors, 4th and 5th axes (rotation), temperature stabilisation and fume extraction.
Applications
•Mixed material laser processing
•Process development
•High-throughput machining
•Thin-film scribing
•Optoelectronics
•Microelectronics
Specifications
Wavelength:
Choose the most suitable wavelengths for your application. (1064, 532, 355, 266, etc)
Laser Type: Diode PumpedSolid State
G系列双光束生产激光微加工系统
在一个完全集成的软件包,具有双光束能力领导边缘激光微加工
主要优点
•双波长意味着,可以加工各种材料
•稳固的减震外框设计,确保稳定性
•关闭按键操作,最大的可用性
•先进的CNC控制器软件
•在苛刻的工业环境,高品质,高灵活性,在R&D环境的过程中发展提供高产量的双波长激光微加工系统。
一些激光器不适用于加工某些材料 ,因为他们没有适当的吸收,使加工缓慢或无效。双波长系统允许最大的灵活性,增加了你需要加工的一系列的材料。这种能力允许对复合材料进行处理,减少工艺步骤,降低成本。
交钥匙系统设置有一个1级的外壳,从而确保您的操作人员的安全。稳固的减震外框设计,确保了最终的稳定和保证生产的零件的最大重复性和最低浪费。
牛津激光先进的CNC控制器和软件,意味着你可以从CAD模型到生产阶段,只需要一个简单的步骤,使用单屏软件控制。线性阶段提供300毫米的XY行程(可选增加至400mm )和150mm Z行程。一个轴的视觉系统简化对齐,并允许他们完成零件的检查。
如果需要,我们可以添加穿孔系统,振镜扫描仪,锥度还原系统,自动对焦和自动对齐,高度和深度传感器,第4和第5轴(旋转),温度稳定和排烟。
应用
•混合材料激光加工
•工艺开发
•高通量加工
•薄膜划线
•光电
•微电子
规格
波长:
为您的应用选择最合适的波长。 (1064,532,355,266等)
G Series Dual Beam Production Laser Micromachining System
Leading edge laser micro machining in a fully integrated package with dual beam capability
Key Benefits
•Dual wavelength means that a wide range of materials can be processed
•Vibration isolated granite construction for ultimate stability
•Turn-key operation for maximum usability
•Advanced CNC controller software
A dual wavelength laser micromachining system offering high throughput in a demanding industrial setting, or high-quality, high-flexibility process development in an R&D environment.
Some lasers are unsuitable for machining some materials - they are not suitably absorbed, making machining slow or ineffective. A dual wavelength system allows maximum flexibility by increasing the range of materials that you can machine. This capability allows composite materials to be processed, reducing process steps and reducing costs.
The turn-key system features a class 1 enclosure, which ensures that your operator remains safe. The vibration isolated granite machining bed ensures ultimate stability and guarantees maximum repeatability and minimum wastage in the parts produced.
Oxford Lasers advanced CNC controller and software means that you can go from CAD model to a produced part in one simple step, with single screen software control. The linear stage offer
If required, we can add trepanning systems, galvo scanners, taper reduction systems, auto-focus and auto-alignment, height and depth sensors, 4th and 5th axes (rotation), temperature stabilisation and fume extraction.
Applications
•Mixed material laser processing
•Process development
•High-throughput machining
•Thin-film scribing
•Optoelectronics
•Microelectronics
Specifications
Wavelength:
Choose the most suitable wavelengths for your application. (1064, 532, 355, 266, etc)
Laser Type: Diode Pumped
G系列双光束生产激光微加工系统
在一个完全集成的软件包,具有双光束能力领导边缘激光微加工
主要优点
•双波长意味着,可以加工各种材料
•稳固的减震外框设计,确保稳定性
•关闭按键操作,最大的可用性
•先进的CNC控制器软件
•在苛刻的工业环境,高品质,高灵活性,在R&D环境的过程中发展提供高产量的双波长激光微加工系统。
一些激光器不适用于加工某些材料 ,因为他们没有适当的吸收,使加工缓慢或无效。双波长系统允许最大的灵活性,增加了你需要加工的一系列的材料。这种能力允许对复合材料进行处理,减少工艺步骤,降低成本。
交钥匙系统设置有一个1级的外壳,从而确保您的操作人员的安全。稳固的减震外框设计,确保了最终的稳定和保证生产的零件的最大重复性和最低浪费。
牛津激光先进的CNC控制器和软件,意味着你可以从CAD模型到生产阶段,只需要一个简单的步骤,使用单屏软件控制。线性阶段提供300毫米的XY行程(可选增加至
如果需要,我们可以添加穿孔系统,振镜扫描仪,锥度还原系统,自动对焦和自动对齐,高度和深度传感器,第4和第5轴(旋转),温度稳定和排烟。
应用
•混合材料激光加工
•工艺开发
•高通量加工
•薄膜划线
•光电
•微电子
规格
波长:
为您的应用选择最合适的波长。 (1064,532,355,266等)
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