Interflux IF2005M无卤化物无残留助焊剂

1.Deion: Interflux?IF 2005M is a low solids noclean flux, designed to evaporate during the soldering process. This means also the safest no-clean flux for hightech circuits. With no rosin nor resin present to create a sticky residue, there is nothing left after we soldering to foul test pins or prevent electrical contact. Furthermore, machine and carrier pollution are very little compared to other fluxes. This absolutely halide free flux meets all Bellcore and IPC requirements and is QPL- listed (approved to MIL-F-14256F). It is formulated to provide the best combination of solderability, ease of processing and reliability. Great solderability on HAL, Ni Au, I-Sn, I-Ag and OSP coated PCB’s. 2.Physical and chemical properties Appearance:Clear colourless liquid Solid content:1,85% ± 0,15% Density at 20°C:0,807—0,809 g/ml Acid number:14 – 16 mg KOH/g 3.Preheating Interflux IF2005M The recommended preheat temperature measured on the topside of the boards is 80°C-130°C. This value is retrieved from field experience. The flux can he lower preheating temperatures but the solvent should be evaporated before we contact. The flux can he higher preheating temperatures but beware not to exhaust the flux. If sible oid hot air convection preheating temperatures above 150°C. Preheat slope: 1-3°C/s .OSP finished boards can benefit with enough flux, lower preheat temperatures and high solder pressure on the (first) we to get good through hole filling. 4.Interflux?IF 2005M We contact Typical we contact or dwell time value is 3-4s when using a single solder we. For double we soldering systems typical values are 1-2s for the first we and 2-4s for the second we. Lower total dwell time limit is 2s. Solder wetting can be optimal at lower contact times however longer contact times facilitate total flux wash off from the boards. The maximum upper limit will be determined by flux exhaustion and physical limitations of the board and components. Indications for flux exhaustion are bridging, icicling, webbing,... 5.Handling Storage Store the flux in the original packaging, tightly sealed at a preferred temperature of +5° to +25°C Safety IF 2005M is flammable. Please always consult the safety datasheet of the product. Density cool For open flux application systems like e.g foam fluxing a flux density cool can be useful. The density of the IF 2005M flux shall be checked using a suitable density meter, the value showed by the density meter should be com pared, after temperature compensation, with the value in the IF 2005M density table and may only be adjusted with the T 2005M accordingly. Titration check For open flux application systems like e.g foam fluxing, a titration check can be useful. The solids content value of the IF 2005M flux can be determined by titration. The liquids for titration are ailable at Interflux. Adjustments of the solid content may only be done by using T 2005M conditioner