场效应管回收

集成电路,POWER MANAGEMENT UNIT,,WLCSP,6×4 Array,2.53×1.71mm,24-Bump,,,,,RF6561TR7,RFMD,
集成电路,3G+ PowerSmart,POWER PLATFORM PA,,6.6×13.7×1.02mm,,,,,,RF6261TR13,RFMD,
电源管理芯片,Power Management Unit,187-pin nFBGA,7×7×1.0mm,0.40 mm,N/A,TWL6030B1ADCMR,TI
电源管理芯片,Power Management Unit,16-Bump WLCSP,1.73×1.73×0.606mm,0.40 mm,N/A,RF6590,RFMD
前端模块,Diversity Front End Module,Band1(4)/2/5/8/12(17),26 Pin,4.7×3.9×1.0 mm,For NA-ATT,HFQSWEJUA-138,MURATA
前端模块,Diversity Front End Module,For EU : Band1/3/5/7/8/20,26 Pin,4.7×3.9×1.0 mm,N/A,HFQSWEJUA-136,MURATA
平台主芯片,Mobile Station Modem,576 NSP,576.0 Balls,11×11×1.05 mm,0.40 mm,Non-Security,N/A,MSM-7627A-0-576NSP-MT-01-0,QUALCOMM
WIFI/Bluetooth芯片,WLAN+BT chip,WLAN IEEE 802.11b/g/n,60pin,8.2×7.3×1.25 mm,N/A,Security,Broadcom BCM4329 WLAN+BT,WBB23BOKR05,SAMSUNG
前端集成模块,WLAN/BT FEM,802.11b/g/n WLAN/BT FEM,16pin,3.0×3.0×0.45 mm,N/A,TQM679002,TRIQUINT
集成电路,3V TD-SCDMA/W-CDMA LINEAR,3×3×1.0mm,10pin,N/A,RF7234,RFMD
射频开关,SPDT Switch,1.5×1.5mm,MLPD 6-pin,N/A,SKY13319-374LF,SKYWORKS
四工器,Quadplexer,PCS and Cellular band,Cellular/PCS Duplexer Rx&Tx,3×5×1.05mm,N/A,N/A,ACFM-7110-TR1,AVAGO
负载开关,Loading Switch,3.1×3.0mm,SOT23-5,500mA,LPW5206B5F,LOWPOWER
天线开关模块,Antenna Switch Module,SP8T,2.85- 4.7 V,PG-VCCN-20-1(3.2×2.8×1mm),2GSM Tx and 6WCDMA-TRx,BGSF18DM20,INFINEON
模拟开关,DPDT AN/Alog Switch,1.8×1.4mm,UTQFN 10L,N/A,SGM7227YUWQ10G/TR,SGMICRO
模拟开关,SPDT AN/Alog Switch,2×2mm,QFN, 6-pin,N/A,RF1200,RFMD
稳压器,LDO,N/A,SOT-23-5,2.8V,150mA,RP119N281D-TR-FE,RICOH
电压调节器,LDO,N/A,SOT-23-5,1.8V,150mA,RP119N181D-TR-FE,RICOH
稳压器,LDO,1.0×1.0mm,PLP1010-4,3.0V,150mA,RP103K301D-TR,RICOH
双路稳压器,Dual LDO,3.02×2.95mm,TSOT-23-6L,250mA,1.2V/1.8V,SGM2027-AAYTN6G/TR,SGMICRO
稳压器,LDO,2.9×2.8mm,SOT-23-5,3.0V,500mA,RT9013-30GB,RICHTEK
稳压器,LDO,2.9×2.8mm,SOT-23-5,2.5V,500mA,RT9013-25GB,RICHTEK
稳压器,LDO,2.9×2.8mm,SOT-23-5,500mA,1.2V,RT9013-12GB,RICHTEK
稳压器,LDO,3.1×3.0mm,SOT-25,500mA,3.3V,RT9167A-33GB,RICHTEK
稳压器,LDO,2.9×2.8mm,SOT-23-5,2.8V,500mA,RT9013-28GB,RICHTEK
无线收发芯片,EDGE/HSPA+ Transceiver IC,PG-WFWLB-138-2,5×5.3×0.8mm,0.40 mm,N/A,PMB5712A1,INFINEON
无线收发芯片,RF Transceiver IC,196 NSP,7.8×6.2×1.0mm,0.40 mm,N/A,RTR-8600-0-196NSP-TR-0A-0,QUALCOMM
射频放大芯片模组,RF PA Module,Broadband PAM for Band 1,2,5,8,14 pad,3.0×4.2×0.9 mm,N/A,SKY77758,SKYWORKS
射频放大芯片,RF PA,N/A,Small, low profile package,3*3*0.85 mm,N/A,SKY77709,SKYWORKS
射频放大芯片,RF PA,Quad-Band GSM/EDGE,15pin,5.00×3.50×0.90mm,N/A,TQM7M5050,TRIQUINT
射频功率放大器,RF PA,UMTS Band 4 PA,10pin,3×3×0.9 mm,N/A,ACPM-5504-TR1,AVAGO
射频功率放大器,RF PA,CDMA Dual Band Power Amplifier,14pin,4×5×0.9mm,N/A,ACPM-7353-TR1,AVAGO
MOS FET功放模块,MOS FET PA module,Quad-Band T×/semi-Quad R×,34pin,6.0×8.0×1 mm,With Antenna Switch,RPF89011B,RENESAS
射频功率放大器,RF PA,TD-SCDMA 1880-1920M/2010-2025M,10pad,3.0×3.0×0.85mm,N/A,SKY77198-12,SKYWORKS
MOS FET功放模块,MOS FET PA module,Dual band Antenna Switch,34pin,6.0×8.0×1.0(max)mm,N/A,RPF89007B,RENESAS
射频功率放大器,RF PA,WCDMA/HSDPA/HSUPA/HSPA+/LTE,10pin,3.0×3.0×0.9 mm,LTE-Band V (824-849MHz),SKY77704,SKYWORKS
音频放大器,Audio PA,1.42×1.42mm,9-ball WCSP,2W,class D,SN2145IY09E,SI-EN
内存芯片,MCP Memory,N/A,32 Gb,48 pin TSOP,20×12×1.2 mm,0.5 mm,3.3 V,NAND,H27UBG8T2BTR-BC,HYNIX
内存芯片,Memory,Spi Flash,128Mbit,WSON8 6*5-mm,6.00×5.00×0.75 mm,1.27 mm,1.8 V,N/A,W25Q128FWPIM,WINBOND
内存芯片,Memory,64M bit serial flash,,N/A,MLP8,6×5 mm,1 mm,1.8 V,N/A,N25W064A11EF640F,MICRON
内存芯片,MCP Memory,e.MMC+LPDDR2 S4 SDRAM,4 GB e.MMC+4 Gb(256 Mb x 16),FBGA162 ball,11.5×13×1.0 mm,0.5 mm,N/A,N/A,KMNJS000FM-B205,SAMSUNG
内存芯片,MCP Memory,DDR2 Mobile RAM,8Gb DDR2 Mobile RAM,216-ball FBGA,12×12×0.8mm,0.40 mm,1.2 V,POP,EDB8164B3PF-1D-F,ELPIDA
内存芯片,MCP Memory,LPDDR2-S4 SDRAM+LPDDR2-S4,4Gb+ 4Gb,216-ball FBGA,12×12×0.8mm,0.40 mm,1.2 V,PoP,K3PE7E700M-XGC1,SAMSUNG
内存芯片,MCP Memory,NAND Flash+Mobile DDR SDRAM,2Gb (128M x16)+1Gb (64M x16),153-ball FBGA,8×9×1.0mm,0.50 mm,1.8 V,N/A,K522H1HACF-B050,SAMSUNG
内存芯片,MCP Memory,eMMC,4GB Emmc,153-ball FBGA,11.5×13×1.0mm,0.80 mm,1.8 V,MLC,KLM4G1FE3B-B001,SAMSUNG
内存芯片,MCP Memory,eMMC,8GB Emmc,153-ball TFBGA,11.5×13×1.0mm,0.50 mm,1.8 V,N/A,KLM8G2FE3B-B001,SAMSUNG
内存芯片,MCP Memory,NAND Flash+mobile DDR,2Gb+1Gb,P-TFBGA130-0809-0.65AZ,8.0×9.0×1.0mm,0.650 mm,1.8 V,N/A,TYAB0A111254KA20,TOSHIBA
内存芯片,MCP Memory,NOR Flash+UtRAM2,128Mb +64Mb UtRAM2,84-ball FBGA,8×11.6×1.2mm,0.80 mm,1.8 V,N/A,K5L2866ATC-BQ12,SAMSUNG
内存芯片,MCP Memory,Flash+ PSRAM,32Mb(2M×16)+8Mb (512K×16),56-ball BGA,7×9×1.2mm,0.80 mm,1.8 V,N/A,FM91L03208UA-77BGE2B,ESMT
内存芯片,MCP Memory,Flash+ PSRAM,32Mb(2M×16)+8Mb (512K×16),56-ball BGA,7×9×1.2mm,0.80 mm,1.8 V,N/A,FM91L03208UA-77BGE2B,ESMT
无线收发芯片,Transceiver,LFCSP-40,6×6×0.85mm,0.50 mm,N/A,AD6546,ANALOG DEVICES
基带芯片,Baseband Chipset,745PNSP,745 Balls,12×12×0.78mm,0.4 mm,N/A,W/O HDCP，1.4GHz,MSM-8230-2-745PNSP-TR-02-0-AA,QUALCOMM
基带芯片,Baseband Chipset,745PNSP,745 Balls,12×12×0.78mm,0.4 mm,N/A,W/O HDCP,MSM-8230-2-745PNSP-TR-02-0,QUALCOMM
基带芯片,集成电路,Multimedia Device,S-PBGA-N547,547 Balls,12.00×12.00×0.90 mm,0.4 mm,Security,HS with TI dummy keys,X4460B5MCBS,TI
基带处理芯片,Multimedia Baseband Processor,344-pin discrete package,N/A,11×11x1.0 mm,0.50 mm,Non-Security,N/A,21654GB1IFFBG,BROADCOM
集成电路,HEDGE Baseband Processor,FBGA,415.0 Balls,11×11 mm,N/A,Security,N/A,BCM2157B0KFB01G,BROADCOM
基带处理芯片,Baseband Processor,PG-VF2BGA-221-1,626.0 Balls,7.5×7.5×1.0 mm,0.40 mm,Non-Security,N/A,PMB9811.BV1.0,INFINEON
基带处理芯片,Baseband Processor,TFBGA,564.0 Balls,15×15×1.2 mm,0.3780 mm,Security,N/A,MT6516SA,MTK
基带处理芯片,Baseband Processor,415-pin FBGA,N/A,11×11×1.2 mm,0.40 mm,Non-Security,N/A,BCM2157B0KFBG,BROADCOM
FM芯片,FM radio tuner,FM 65 to 108 MHz,24 pin QFN,4×4×0.9 mm ,0.50 mm,Non-Security,N/A,RDA5802E(F),RDA
射频功率放大器,RF PA,UMTS Band1,10pin,3×3×1.0(typ)mm,N/A,ACPM-5201-TR1,AVAGO
内存芯片,MCP Memory,NAND flash+ LPSDRAM,1Gb + 512Mb  LPSDRAM,107-ball TFBGA,10.5×13×1.2mm,0.80 mm,2.6 V,N/A,NANDA9W3N6CZBB5E,NUMONYX
蓝牙/FM芯片,BT with FM Receiver,BT 2.1 with FM Receiver,64-PIN WLBGA,3.374×3.344×0.55 mm,0.40 mm,Non-Security,N/A,BCM20780B0KUBG,BROADCOM
模拟开关,SPDT Switch,1.5×1.5×0.4mm,12pin,N/A,XM0860ST-DL1201,MURATA
发射器,Transmit Module,Dual Band GSM850/PCS1900,23pin,6.63×5.24×1.0 mm,N/A,RF7167,RFMD
发射器,Transmit Module,Dual band GSM900/DCS1800,23pin,6.63×5.24×1.0 mm,N/A,RF7166,RFMD
发射器,Transmit Module,EGSM900/DCS1800/PCS1900,23pin,6.63×5.24×1.0 mm,N/A,RF7163,RFMD
无线收发芯片,EDGE RF single chip,LFCSP-40,6×6×0.85mm,0.50 mm,N/A,AD6546BCPZ,ANALOG DEVICES
PA模组,Module with Power Amplifier and Integrated Duplexer,WCDMA Mini PAiD 850,,DGD019M01, (B30312-D2017-Q121),EPCOS,
前端集成模块,SAW Front End Module,GSM/WCDMA SAW Front End Module,24pin,4.5×3.2mm,N/A,B30674-D5017-Q824,EPCOS
前端集成模块,Front End Module,GSM900/1800 dual band,20pin,5.5×5.5×1.2mm,N/A,RPF88130B,RENESAS
无线收发芯片,GSM/GPRS/EDGE RF transceiver,QFN40,6×6×0.85mm,0.50 mm,N/A,MT6140AN/DRC-L,MTK
模拟开关,DPDT AN/Alog Switch,1.8×1.4mm,WQFN-10,N/A,SGM7222YWQ10/TR,SGMICRO
蓝牙/BB处理芯片,BT trans and BB processor,Transceiver and Baseband,50pin,4.5×4×0.8mm,0.50 mm,Non-Security,N/A,BCM2070CB0KUFBG,BROADCOM
基带芯片,Baseband Chipset,424 CSP,N/A,12×12×1.05 mm,0.5 mm,Security,N/A,QSC-6055-0-424CSP-TR-08-0,QUALCOMM
电源管理芯片,Power Management Unit,97  CSP,6.0×6.0×1.2mm,0.50 mm,N/A,PM-6658-0-97CSP-TR-03,QUALCOMM
连接器,CONN C-Clip Contact W:4.0mm H:1.55mm SMT(3.6t) RoHS,DY-C30BQ-G,Daeyoung KTX
连接器,CONN C-Clip Contact W:3.5mm H:1.16mm SMT (2.2t) RoHS,DY-C20AP-G,Daeyoung KTX
集成电路,IC Positive Overvoltage Controller with Internal Low RON NMOS FET, 1.6mmx2mm DFN6 RoHS,NCP349MNAETBG,Onsemi
磁珠,Ferrite bead 30ohm@100MHz 25% 0.035ohm 2.2A SMT 0402 RoHS,BLM15PD300SN1D,Murata