BMA250

Yole发布了Bosch Sensortec 3轴MEMS加速度计：BMA250的拆解和逆向成本分析报告。BMA250是一种低功耗的数字加速度计，超小封装：LGA 2x2x0.9mm3。Bosch在MEMS工艺方面做了改进，使得芯片面积和厚度减小。
BMA250目标应用是游戏控制器、手机、数码摄像机、3D遥控器/鼠标、便携式导航设备、安全和健康领域。
该报告提供BMA250拆解内容如下：
* 清晰照片
* 材料分析
* 装配示意图说明
* 工艺流程
* 深入经济分析
* 制造费用明细
* 售价估计
报告掠影：

Bosch BMA250 X射线侧视图

Bosch BMA250 X射线顶视图

封装打开后扫描电镜照片

MEMS设备费用构成
报告目录：
1. Overview / Introduction
– Executive Summary
– Reverse Costing Methodology
2. Bosch Sensortec Company Profile
– Bosch Sensortec
– BMA250 Specifications & Block Diagram
3. Physical Analysis
– Package Characteristics & Markings
– Package Opening & Bonding Number
– Device Structure
– ASIC – Dimensions
– ASIC – Markings & Bond Pads
– ASIC – Functions
– ASIC Synthesis
– MEMS Sensor – Dimensions and Marking
– MEMS Sensor – X-Axis SEM Views
– MEMS Sensor – Y-Axis SEM Views
– MEMS Sensor – Z-Axis SEM Views
– MEMS Sensor – Capacitances electrodes
– Component Cross-Section
– MEMS Cross-Section AA
– MEMS Cross-Section BB
– Physical Data Summary
– MEMS process characteristics
– Comparisons with Previous Generation
4. Manufacturing Process Flow
– Global Overview
– ASIC Process Flow
– Description of the ASIC Wafer Fabrication Unit
– MEMS Process Flow
– Description of the MEMS Wafer Fabrication Unit
5. Cost Analysis
– Yields Explanation
– Die per wafer & Probe Test
– ASIC Wafer Front-End Cost
– ASIC Die Cost
– MEMS Wafer Front-End Cost
– MEMS Front-End Cost per Process Steps
– MEMS Front-End : Equipment Cost per Family
– MEMS Front-End : Material Cost per Family
– MEMS Back-End 0 : Probe Test & dicing
– MEMS Die Cost
– Back-End 1 : Packaging, Final test, calibration
– BMA250 Component Cost (FE + BE 0 + BE 1)
– Yields Synthesis
6. Estimated Manufacturer Price Analysis
– Supply Chain Analysis
– Manufacturers financial ratios
– Estimated Manufacturer Price
7. Conclusion


供应BMA250、深圳代理BMA250、现货供应BMA250