厂商 ：深圳市北测检测技术有限公司（电池事业部）
广东 深圳- 主营产品：
- 锂电池UN383
- UL
- PSE
联系电话 ：13602624114
商品详细描述
|
娉曟簮渚濇嵁
銆�銆�涓崕浜烘皯鍏卞拰鍥戒俊鎭骇涓氶儴锛屼腑鍗庝汉姘戝叡鍜屽浗鍥藉鍙戝睍鍜屾敼闈╁鍛樹細锛屼腑鍗庝汉姘戝叡鍜屽浗鍟嗗姟閮紝涓崕浜烘皯鍏卞拰鍥芥捣鍏虫�荤讲锛屼腑鍗庝汉姘戝叡鍜屽浗鍥藉宸ュ晢琛屾斂绠＄悊鎬诲眬锛屼腑鍗庝汉姘戝叡鍜屽浗鍥藉璐ㄩ噺鐩戠潱妫�楠屾鐤�诲眬锛屼腑鍗庝汉姘戝叡鍜屽浗鍥藉鐜淇濇姢鎬诲眬鑱斿悎浼氱鐨勩�婄數瀛愪俊鎭骇鍝佹薄鏌撴帶鍒剁鐞嗘柟娉曘�嬶紙绗�39鍙凤級
銆�銆�锛圡anagement Methods for Controlling Pollution by Electronic Information Products / Ministry of Information Industry Order #39锛� 閫傜敤鑼冨洿 銆�銆�鍦ㄤ腑鍗庝汉姘戝叡鍜屽浗澧冨唴鐢熶骇銆侀攢鍞拰杩涘彛鐢靛瓙淇℃伅浜у搧杩囩▼涓帶鍒跺拰鍑忓皯鐢靛瓙淇℃伅浜у搧瀵圭幆澧冮�犳垚姹℃煋鍙婁骇鐢熷叾瀹冨叕瀹筹紝閫傜敤鏈姙娉曘�備絾鏄紝鍑哄彛浜у搧鐨勭敓浜ч櫎澶栥�� 鎽樿鍐呭 銆�銆�鐢靛瓙淇℃伅浜у搧鍦ㄨ璁°�佺敓浜у拰閿�鍞繃绋嬩腑搴斿綋绗﹀悎鐢靛瓙淇℃伅浜у搧鏈夋瘨銆佹湁瀹崇墿璐ㄦ垨鍏冪礌鎺у埗鍥藉鏍囧噯鎴栬涓氭爣鍑嗭紝鍒嗕袱闃舵鏂借锛� 绗竴闃舵 銆�銆�鎶曟斁甯傚満鐨勭數瀛愪俊鎭骇鍝佷笂搴旀爣璇嗙幆淇濅娇鐢ㄦ湡闄愶紝鏍囪瘑鍏朵腑鍚湁鐨勬湁姣掋�佹湁瀹崇墿璐ㄦ垨鍏冪礌鍚嶇О銆佸惈閲忋�佹墍鍦ㄩ儴浠跺強鍏跺彲鍚﹀洖鏀跺埄鐢ㄧ瓑锛涚數瀛愪俊鎭骇鍝佸寘瑁呯墿涓婏紝搴旀爣娉ㄥ寘瑁呯墿鏉愭枡鍚嶇О銆傚彲鎸夌収鏍囧噯SJ/T 11363-2006銆丼J/T 11364-2006銆丼J/T 11365-2006.GB 18455-2001鐨勮姹傝繘琛屻�� 绗簩闃舵 銆�銆�杩涘叆閲嶇偣绠＄悊鐩綍锛堝埗瀹氫腑锛� 鐨勪骇鍝佸繀闇�纭繚浜у搧涓湁姣掓湁瀹崇墿璐ㄥ凡琚浛浠ｏ紝鎴栧惈閲忎笉瓒呰繃闄愰噺鏍囧噯涓旈�氳繃寮哄埗鎬т骇鍝佽璇侊紙CCC璁よ瘉锛� 銆�銆�娆х洘RoHS浣撶郴涓庝腑鍥絉oHS浣撶郴鍦ㄥ叿浣撴墽琛屼笂鏈変笉鍚岋細娆х洘鍋氭硶鏄鍏堢珛娉曠姝㈢數瀛愪骇鍝佸惈鏈夊叚绉嶆湁瀹崇墿璐紝鐒跺悗鍒楀嚭涓�绯诲垪鏆傛椂瓒呮爣鐨勭绫伙紝绛変互鍚庢妧鏈潯浠舵垚鐔熶簡鍐嶇Щ鍑鸿繖涓洰褰曘�備腑鍥芥槸鍙嶈繃鏉ョ殑锛氫竴鏃︽煇涓骇鍝佹妧鏈潯浠舵垚鐔熶簡灏辨斁鍏ョ洰褰曪紝鍦ㄧ洰褰曞唴鐨勪骇鍝佹槸涓嶈兘瓒呮爣鐨勩�� 娆х洘RoHS鎸囦护璞佸厤椤� 銆�銆�鐢变簬鎶�鏈棶棰橈紝鏈夐儴鍒嗘潗鏂欐垨鑰呬骇鍝佺殑鍒堕�犳妧鏈繕鍋氫笉鍒癛OHS鎸囦护瑕佹眰锛屽湪缁忚繃鍚戞鐩熺殑鐗规畩鐢宠鍚庯紝浠ヤ笅椤圭洰鍙互鑾峰緱璞佸厤锛堥儴鍒嗚眮鍏嶆槸鏈夋湡闄愮殑锛夛細 銆�銆�RoHS ExemptionsEU RoHS 銆�銆�Items Exemption Clauses 銆�銆�1 Mercury in compact fluorescent lamps not exceeding 5 mg per lamp 銆�銆�2 Mercury in straight fluorescent lamps for general purposes not exceeding: 銆�銆�- halophosphate 10 mg 銆�銆�- triphosphate with normal lifetime 5 mg 銆�銆�- triphosphate with long lifetime 8 mg. 銆�銆�3 Mercury in straight fluorescent lamps for special purposes. 銆�銆�4 Mercury in other lamps not specifically mentioned in this Annex. 銆�銆�5 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. 銆�銆�6 Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight. 銆�銆�7 - lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) 銆�銆�- lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications 銆�銆�- lead in electronic ceramic parts (e.g. piezoelectronic devices). 銆�銆�8 Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations 銆�銆�9 Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators. 銆�銆�10 Lead used in compliant pin connector systems 銆�銆�11 Lead as a coating material for the thermal conduction module c-ring 銆�銆�12 Lead and cadmium in optical and filter glass 銆�銆�13 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight 銆�銆�14 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages 銆�銆�15 DecaBDE in polymeric applications 銆�銆�16 Lead in lead-bronze bearing shells and bulbs 銆�銆�17 Lead in linear incandescent lamps with silicate coated tubes 銆�銆�18 Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications 銆�銆�19 Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as specially lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb) 銆�銆�20 Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL) 銆�銆�21 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD) 銆�銆�22 Lead and cadmium in printing inks for the application of enamels on borosilicate glass. 銆�銆�23 Lead as impurity in RIG (rare earth iron gamet) Faraday rotators used for fibre optic communication systems. 銆�銆�24 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with coppler lead frames. 銆�銆�25 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors. 銆�銆�26 Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements, notably in the front and rare glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes. 銆�銆�27 Lead oxide in the glass envelope of Black Light Blue (BLB) lamps. 銆�銆�28 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers. 銆�銆�29 Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasterners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007. 銆�銆�30Lead bound in crystal glass as defined in Annex I (Category 1,2,3 and 4) of Council Directive 69/493/EEC 銆�銆�2009骞�6鏈�11鏃ワ紝娆х洘OJ鍒婄櫥浜�2009/443/EC锛屾柊澧炰簡6椤筊oHS鎸囦护鐨勮眮鍏嶏紝鍒嗗埆濡備笅锛� 銆�銆�33. Lead insolders for the soldering of thin copper wires of 100 渭m diameter andless in power transformers. 鐢靛姏鍙樺帇鍣ㄤ腑鐩村緞100寰背鍙婁互涓嬬粏閾滅嚎鎵�鐢ㄧ剨鏂欎腑鐨勯搮 銆�銆�34. Lead in cermet-based trimmer potentiometer elements. 閲戝睘闄剁摲璐ㄧ殑寰皟鐢典綅璁′腑鐨勯搮 銆�銆�35. Cadmium in photoresistors for optocouplers applied in professionalaudio equipment until 31 December 2009.2009骞�12鏈�31鏃ュ墠涓撲笟闊抽璁惧鐨勫厜鑰﹀悎鍣ㄤ腑浣跨敤鐨勫厜鏁忕數闃荤殑闀� 銆�銆�36. Mercury used asa cathode sputtering inhibitor in DC plasma displays with a content upto 30 mg per display until 1 July 2010. 2010骞�7鏈�1鏃ュ墠鐩存祦绛夌瀛愭樉绀哄櫒涓槾鏋佹簠灏勬姂鍒跺墏涓殑姹烇紝鍏跺惈閲忎笉寰楄秴杩�30姣厠/鏄剧ず鍣� 銆�銆�37. Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body. 浠ョ〖閰搁攲鐜荤拑浣撲负鍩虹鐨勯珮鍘嬩簩鏋佺鐨勭數闀�灞傜殑閾� 銆�銆�38. Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide. 鐢ㄦ哀鍖栭搷杩炴帴閾濆埗鎴愮殑鍘氳啘娴嗘枡涓晧鍜屾哀鍖栭晧 銆�銆�姝ゅ墠锛屽湪6鏈�5鏃ワ紝娆х洘杩樺垔鐧讳簡2009/428/EC锛屼粠2011骞�1鏈�1鏃ヨ捣锛屽皢鍘熻眮鍏嶇殑绗�22鐐光�滃厜绾ら�氳绯荤粺绋�鍦熼搧鐭虫Υ鐭虫硶鎷夌鏃嬭浆鍣ㄤ腑浣滀负鏉傝川鐨勯搮鈥濅粠璞佸厤鍒楄〃涓Щ闄ゃ�� 銆�銆�鍏跺疄rohs涓�鐩撮兘鏈夊湪澧炲姞璞佸厤鏉′緥銆� |
相关产品推荐
