厂商 ：深圳市网际包装制品有限公司业务部
广东 深圳- 主营产品：
- 防静电铝箔袋
- 防静电屏蔽袋
- 镀铝膜复合气泡袋
联系电话 ：13417329779
商品详细描述
网格膜复合气泡袋简介：我公司现研发的复合型防静电气泡袋填补了国内防静电袋的不足之处。（很多防静电袋没复合，时间长易漏气，且防静电袋减震缓冲性能差）
网格膜复合气泡袋特征：该产品两层结构，外层网格导电膜，该产品适用于远航运输电子产品的包装
网格膜复合气泡袋技术：表面电阻是103-105Ω，内层防静电气泡袋表面电阻值是108—1010Ω。
网格膜复合气泡袋用途：防静电气泡袋，气泡片可防止产品在生产搬运过程中因碰撞、摩擦或静电引起的破坏。主要用于电子元器件，PC板等的包装
Grid?Bubble?Mailer|Envelope?Introduction：Our?company?is?research?and?development?of?composite?anti-static?bubble?bags?to?fill?the?domestic?anti-static?bag?deficiencies.?(Not?a?lot?of?complex?anti-static?bag,?easy?to?leak?a?long?time,?and?anti-static?bag?shock?absorption?cushioning?poor?performance)
Grid?Bubble?Mailer|Envelope?features：The?two-tier?structure,?the?outer?conductive?grid?film,?The?product?applies?to?oceangoing?transportation?electronics?packaging?
Grid?Bubble?Mailer|Envelope?technical：Surface?resistance?is?103-105Ω,?anti-static?bubble?bag?inner?surface?resistance?value?is?108—1010Ω.?
Grid?Bubble?Mailer|Envelope?use：Anti-static?bubble?bags,?bubble?film?prevents?product?handling?in?the?production?process?due?to?collisions,?caused?by?friction?or?static?electricity?damage.?Mainly?used?in?electronic?components,?PC?boards,?such?as?packaging.
网格膜复合气泡袋特征：该产品两层结构，外层网格导电膜，该产品适用于远航运输电子产品的包装
网格膜复合气泡袋技术：表面电阻是103-105Ω，内层防静电气泡袋表面电阻值是108—1010Ω。
网格膜复合气泡袋用途：防静电气泡袋，气泡片可防止产品在生产搬运过程中因碰撞、摩擦或静电引起的破坏。主要用于电子元器件，PC板等的包装
Grid?Bubble?Mailer|Envelope?Introduction：Our?company?is?research?and?development?of?composite?anti-static?bubble?bags?to?fill?the?domestic?anti-static?bag?deficiencies.?(Not?a?lot?of?complex?anti-static?bag,?easy?to?leak?a?long?time,?and?anti-static?bag?shock?absorption?cushioning?poor?performance)
Grid?Bubble?Mailer|Envelope?features：The?two-tier?structure,?the?outer?conductive?grid?film,?The?product?applies?to?oceangoing?transportation?electronics?packaging?
Grid?Bubble?Mailer|Envelope?technical：Surface?resistance?is?103-105Ω,?anti-static?bubble?bag?inner?surface?resistance?value?is?108—1010Ω.?
Grid?Bubble?Mailer|Envelope?use：Anti-static?bubble?bags,?bubble?film?prevents?product?handling?in?the?production?process?due?to?collisions,?caused?by?friction?or?static?electricity?damage.?Mainly?used?in?electronic?components,?PC?boards,?such?as?packaging.
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